|
Through-Hole Assembly
Subtronics Assembly Corporation has been
successfully performing cost effective through-hole manufacturing for 13 years.
Through the use of manual/mechanical insertion, trained experienced experts and
ensuring proper tape and reel component purchasing,
Subtronics achieve timely, low cost solutions in through-hole
assembly or mixed assembly productions.
Subtronics currently supports:
•
Simple complexity board assembly
•
High complexity board assembly
•
Mixed SMT and through-hole assembly
•
New Design and RoHS conversion
Subtronics uses the various processes to
efficiently produce through-hole circuit assemblies:
•
Component Lead Forming - use automatic and
semi-automatic forming equipment depending on the
component requirements
•
Manual/Mechanical Assembly - To complete many
through-hole assembly products, some manual actions
have to be performed. Application of parts like staking,
nuts/bolts, riveting, and studs require use of manual
operations and are performed by experienced assemblers.
•
Wave Solder - Boards are baked (to remove
moisture) before passing through the Electrovert Econopak1
wave solder machine. Then the wave soldered boards are
thoroughly inspected for deficiencies and quality.
Finally, our wash system cleans the delivered product.
Electrovert
Econopak1
|
 |
