Subtronics Assembly Corporation performs leaded or lead-free (RoHS) through-hole and mixed assembly for simple and high complexity circuit boards.  

Subtronics uses various processes to efficiently produce through-hole circuit assemblies: 

• Component Lead Forming: Experienced assemblers form-fit component leads using specialized forming equipment, depending on the component requirements.
• Manual/Mechanical Assembly: To complete many through-hole assembly products, some manual actions have to be performed. Application of parts like staking, nuts/bolts, riveting, and studs require use of manual operations and are performed by experienced assemblers.
• Wave Solder: Boards are baked (to remove moisture) before passing through the Electrovert Econopak1 wave solder machine. Then the wave soldered boards are thoroughly inspected for quality.